Deposition apparatus and deposition method using the same
US11499232B2 · kind B2 · utility
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3Claims
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Key dates
| Filing date | Sep 5, 2018 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Sep 5, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45544
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A deposition apparatus and method of deposition are provided. The deposition apparatus includes a gas supply unit, including: a first process gas supply unit blowing a first process gas onto a deposition-target surface; a second process gas supply unit blowing a second process gas different from the first process gas onto the deposition-target surface of the substrate; and air curtain units blocking an area between an area where the process gas is blown and an area where the second process gas is blown, by blowing an inert gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.