Semiconductor component burn-in test module and burn-in test equipment
US11500012B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2020 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Oct 23, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2879
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor component burn-in test module includes a burn-in board and an external power transmission component. The burn-in board includes a plurality of burn-in seats, wherein a plurality of chips are disposed on the burn-in seats. The external power transmission component is arranged at opposite two sides of the burn-in board, where the external power transmission component includes a plurality of conductive members and a plurality of terminal seats. The burn-in board is provided with a plurality of wirings corresponding to the external power transmission component. As such, electric power can be conveyed to the plural burn-in seats of the burn-in board, through the plural terminal seats and the plural conductive strips. This decreases the length and the number of copper foil wirings in the burn-in boards for power transmission, so as to lower the cost of the burn-in boards. Also disclosed is a semiconductor component burn-in test equipment using at least one semiconductor component burn-in test module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.