Three-port silicon beam splitter chip and its fabrication method

US11500218B2 · kind B2 · utility

Assignees

• CHONGQING INSTITUTE OF EAST CHINA NORMAL UNIVERSITY · CN
• University of Shanghai for Science and Technology · CN
• EAST CHINA NORMAL UNIVERSITY · CN

Inventors

• Heping Zeng · Chongqing, CN
• Jijun Feng · Chongqing, CN
• Xinyao Wu · Chongqing, CN

Key dates

• Filing date: Sep 30, 2020
• Grant date: Nov 15, 2022
• Expiry date: Aug 11, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/12061
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A three-port silicon beam splitter chip includes an input waveguide, three output waveguides, and a coupling region disposed between the input waveguide and the output waveguides and being in a square shape. The input waveguide and the output waveguide have a same width K, where 490 nm<K<510 nm, the coupling region, the input waveguide and the output waveguide have a same thickness H, where 210 nm<H<230 nm, and the coupling region has a length L, where 1600 nm<L<2000 nm. The three-port silicon beam splitter chip of the present disclosure has a high integration degree and a small size, and is capable of improving the portability of the wavefront reconstruction device.