Resin, resist composition and method for producing resist pattern
US11500288B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2020 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Nov 6, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/38
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a resin including a structural unit represented by formula (I) and a structural unit represented by formula (a2-A), and a resist composition:wherein R1 represents a hydrogen atom or a methyl group; L1 and L2 each represent —O— or —S—; s1 represents an integer of 1 to 3; s2 represents an integer of 0 to 3; Ra50 represents a hydrogen atom, a halogen atom, or an alkyl group which may have a halogen atom; Ra51 represents a halogen atom, a hydroxy group, an alkyl group, an alkoxy group, an alkylcarbonyl group or the like; Aa50 represents a single bond or *—Xa51-(Aa52-Xa52)nb—; Aa52 represents an alkanediyl group; Xa51 and Xa52 each represent —O—, —CO—O— or —O—CO—; nb represents 0 or 1; and mb represents an integer of 0 to 4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.