Vertical soldering technology for 3D circuit assembly
US11501982B1 · kind B1 · utility
0Cited by
5References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2021 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Aug 27, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit assembly with an electrical connection between two individual Printed Circuit Boards (PCBs) or Circuit Card Assemblies (CCAs) that are vertically stacked with a connection formed entirely of solder and with a gap in between surfaces that components may occupy. Coalescing solder paste merges between the surfaces when it is in a liquid state to form a solder bridge. The resultant assembly can be encapsulated to form a solid monolithic electronic assembly to improve robustness and allow the assembly to better withstand compressive forces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.