Array substrate and display device with interposer bonded to drive circuit and manufacturing method thereof

US11502153B2 · kind B2 · utility

Assignee

• BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD. · CN

Inventors

• Renquan Gu · Beijing, CN
• Qi Yao · Nanhu, CN
• Jaiil Ryu · Beijing, CN
• Zhiwei Liang · Beijing, CN
• Yingwei Liu · Beijing, CN
• Wusheng Li · Shangqiu City, CN
• Muxin Di · Beijing, CN

Key dates

• Filing date: Mar 26, 2019
• Grant date: Nov 15, 2022
• Expiry date: Dec 12, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/1201

Abstract

An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.