Cooling manifold assembly
US11502349B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2020 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Nov 14, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A cooling manifold assembly that is configured to cool power modules in a vehicle includes a planar cooling chamber with a supply inlet and a return outlet; a supply chamber in an upper portion of the planar cooling chamber that is in fluid communication with the supply inlet and configured to couple to adjacent planar cooling chambers at the supply inlet; a return chamber in a lower portion of the planar cooling chamber that is in fluid communication with the return outlet and configured to couple to adjacent planar cooling chambers at the return outlet; and an opening at a distal end of the planar cooling chamber fluidly connecting the supply chamber with the return chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.