Power semiconductor module
US11502434B2 · kind B2 · utility
0Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2019 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Apr 24, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/585
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A power semiconductor module includes a housing accommodating a power circuit with at least one power semiconductor chip, the housing providing at least two power terminals; a printed circuit board mounted to the housing and electrically connected to the power circuit for distributing auxiliary signals; and at least one auxiliary terminal mounted to the printed circuit board with a press-fit connection provided by a body of the auxiliary terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.