Method of manufacturing bonded substrate
US11502665B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | May 15, 2019 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Jul 16, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a bonded substrate, which has a quartz substrate and a piezoelectric substrate bonded, includes irradiating a bonding surface of the quartz substrate and a bonding surface of the piezoelectric substrate with ultraviolet light under a pressure lower than atmosphere pressure. After the irradiation, the bonding surface of the quartz substrate and the bonding surface of the piezoelectric substrate are brought into contact. And the quartz substrate and the piezoelectric substrate are pressurized in a thickness direction to bond the bonding surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.