TWS bone conduction earphone
US11503394B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2020 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Mar 4, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2460/13
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A TWS bone conduction earphone includes an earphone housing and an earphone body. The earphone housing is configured to accommodate the earphone body. The earphone body includes a storage module, a Bluetooth module and a bone conduction module. The storage module is configured to store a Bluetooth address corresponding to a Bluetooth device to be connected and paired. The Bluetooth module is configured to establish a communication with the corresponding Bluetooth device according to the Bluetooth address to obtain an audio signal from the Bluetooth device. The bone conduction module vibrates according to the audio signal for transmitting sounds through ossicles. Using Bluetooth technology, bone conduction wireless answering is realized, without the restriction of the earphone cable. It is more convenient to use, and the sound transmission is realized through bone conduction without damaging hearing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.