Flexible circuit board and heat spreader thereof
US11503698B1 · kind B1 · utility
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1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2021 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | Oct 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10674
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board includes a flexible substrate, an electronic component and a heat spreader. The electronic component and the heat spreader are disposed on a top surface and a bottom surface of the flexible substrate, respectively. The heat spreader includes a copper layer which contains more than or equal to 50% copper grains by volume with (1,0,0) crystallographic orientation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.