Single PCB board camera with enhanced signal integrity and thermal conduction
US11503699B2 · kind B2 · utility
3Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2020 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | May 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Described herein is a sensor device. The sensor device comprises a housing and a printed circuit board encased by the housing. The printed circuit board comprises an image sensor that captures image data, an image sensor processor that processes the image data, a serializer that converts one or more data channels associated with the image data into a single data channel, and one or more exposed surfaces. The one or more exposed surfaces dissipate heat generated by the image sensor, the image sensor processor, and the serializer from the printed circuit board to the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.