Application specific electronics packaging systems, methods and devices
US11503718B2 · kind B2 · utility
1Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2021 |
| Grant date | Nov 15, 2022 |
| Priority date | — |
| Expiry date | May 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.