Biocompatible electromechanical connection for ceramic substrate electronics for biomedical implant
US11504453B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
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Key dates
| Filing date | Oct 17, 2019 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Mar 14, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A biocompatible electrical connection includes: a substrate; a ferrule having a concentric flange at a first end of the ferrule; a first adhesive; and a second adhesive. The substrate includes a hole having a diameter that is a specified amount larger than an outside diameter of the ferrule forming an annular space between the hole and the ferrule, the first adhesive adheres a first surface of the concentric flange of the ferrule to a first surface of the substrate, and the second adhesive fills the annular space between the hole and the ferrule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.