Patent · US Active

Dissolving metal supports in 3D printed metals and ceramics using sensitization

US11504770B2 · kind B2 · utility

1Cited by
15References
20Claims
0Family size

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Inventors

Key dates

Filing dateFeb 16, 2017
Grant dateNov 22, 2022
Priority date
Expiry dateSep 19, 2039

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P10/25
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

Systems and methods are disclosed for fabricating a metal or ceramic component using a 3D printer. An entire 3D printed piece, including both the metal or ceramic component and one or more support structures, is created of a first metal or ceramic material. A sensitization layer is applied to all or part of the 3D printed piece to chemically alter portions of the first metal or ceramic material near the surface making those portions of the material more sensitive to the etching process. The etching process causes the affected material to deplete and separates the component from the support structures without requiring mechanical machining.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.