Laser processing apparatus and laser processing method
US11504803B2 · kind B2 · utility
0Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2019 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Jun 23, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC21D10/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing apparatus includes a light source which outputs a laser light, and a waveform control unit which controls a pulse waveform of the laser light irradiating the workpiece, in which the pulse waveform of the laser light controlled by the waveform control unit includes a main pulse and a foot pulse temporally preceding the main pulse, and a peak intensity of the foot pulse is smaller than a peak intensity of the main pulse, and a peak position of the main pulse is positioned in a retention time period of plasma generated due to an incidence of the foot pulse on the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.