Method for transferring at least one layer of material from a first substrate to a second substrate
US11504958B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2019 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Jun 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/8554
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for transferring at least one layer of material, comprising: producing first and second separating layers (108, 110), one against the other, on a first substrate (104); producing the layer to be transferred on the second separating layer (110); securing the layer to be transferred to a second substrate (106), forming a stack of different materials; and performing mechanical separation at the interface between the separating layers; in which the materials of the stack are such that the interface between the first and second separating layers has the weakest adhesion force, and the method comprises a step reducing an initial adhesion force of the interface between the first and second separating layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.