Method of material transfer

US11504959B2 · kind B2 · utility

Assignees

• Arne Quellmalz · SE
• Frank Niklaus · SE
• Kristinn Gylfason · SE
• Niclas Roxhed · SE
• Göran Stemme · SE

Inventors

• Arne Quellmalz · Stockholm, SE
• Xiaojing Wang · Stockholm, SE
• Kristinn B. Gylfason · Solna, SE
• Niclas Roxhed · Bromma, SE
• Göran Stemme · Stockholm, SE
• Frank Niklaus · Täby, SE

Key dates

• Filing date: Jan 24, 2020
• Grant date: Nov 22, 2022
• Expiry date: Jan 24, 2040

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B82B3/0076
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method for transferring an atomically thin layer comprising providing a target substrate and a donor substrate on which a first atomically thin layer has been formed. The method further comprises disposing an adhesion layer at the donor substrate or at the target substrate. The method further comprises bringing the target substrate and the donor substrate together. Further, the method comprises bonding together the donor substrate, the adhesion layer and the target substrate and removing the donor substrate.