Thermoplastic resin composition
US11505689B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2019 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Jun 28, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/78
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a thermoplastic resin composition that includes: a first copolymer including an unit derived from an aromatic vinyl-based monomer and an unit derived from a vinyl cyan-based monomer; a second copolymer including an unit derived from an alkyl (meth)acrylate-based monomer, an unit derived from an aromatic vinyl-based monomer, and an unit derived from a vinyl cyan-based monomer; a third copolymer including a conjugated diene-based polymer with an average particle diameter of 0.25 to 0.35 μm, an unit derived from an aromatic vinyl-based monomer, and an unit derived from a vinyl cyan-based monomer; and a fourth copolymer including a conjugated diene-based polymer with an average particle diameter of 0.05 to 0.15 μm, an unit derived from an aromatic vinyl-based monomer, and an unit derived from a vinyl cyan-based monomer, and can be used for producing a molded article exhibiting excellent basic properties while being capable of realizing selective transmittance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.