Patent · US Active

Adhesive composition for absorbent articles

US11505719B2 · kind B2 · utility

0Cited by
85References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 18, 2019
Grant dateNov 22, 2022
Priority date
Expiry dateSep 10, 2040

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2423/10
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

Described herein is an adhesive composition including a copolymer. The adhesive composition has a viscosity of from about 2,000 mPa·s to about 11,500 mPa·s at 150° C. The adhesive composition has a Storage Modulus at 37° C. of from about 3 MPa to 9.5 MPa. The adhesive composition has a Yield Stress at 37° C. of from about 0.8 MPa to about 1.45 MPa.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.