Nonaqueous sol-gel for adhesion enhancement of water-sensitive materials
US11505722B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Dec 11, 2017 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Dec 11, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2400/166
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present disclosure provides methods for forming sol-gels, sol-gel films and substrates, such as vehicle components, having a sol-gel film disposed thereon. At least one method of forming a sol-gel includes mixing a metal alkoxide, an acid stabilizer, and an organic solvent to form a first mixture having about 10 wt % or less water content based on the total weight of the first mixture. The method includes mixing an organosilane with the first mixture to form a second mixture having about 10 wt % or less water content based on the total weight of the second mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.