Low profile shock isolating mount
US11506254B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2020 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Oct 26, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16F2234/04
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A low-profile shock isolating payload mounting assembly comprises a first mount, a second mount, and an isolator. The second mount is movable relative to the first mount and comprises a riser comprising an inclined surface. The isolator comprises an inner frame and an outer frame. The inner frame couples to the first mount and comprises a platform and a leg extending from the platform. The leg is inclined to be complementary to the inclined surface of the second mount. The outer frame couples to the second mount and comprises an opening for accessing the platform of the inner frame. The rail is inclined so as to be complementary to the leg to capture the leg between the rail of the outer frame and the inclined surface of the second mount. The isolator operates to dampen vibrations and shocks propagating between the first and second mounts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.