Miniature ultrasonic transducer package
US11508346B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2018 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Apr 1, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10K9/122
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A package design for a micromachined ultrasound transducer (MUT) utilizing curved geometry to control the presence and frequency of acoustic resonant modes is described. The approach consists of reducing in number and curving the reflecting surfaces present in the package cavity to adjust the acoustic resonant frequencies to locations outside the band of interest. The design includes a cavity characterized by a curved geometry and a MUT mounted to a side of a substrate facing the cavity with a sound emitting portion of the MUT facing an opening in the substrate. The substrate is disposed over an opening of the cavity with the substrate oriented such that the MUT located within the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.