Storage module with reduced airflow impedance and improved storage device dynamics performance
US11508414B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2021 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Apr 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20145
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system for cooling a set of components in a compute module and an array of storage devices in a storage module, the array of storage devices comprising rows and columns. The storage module is wider than the compute module to accommodate a larger backplane. The backplane has large vertical vent openings for accommodating connectors of storage devices connecting to the backplane. Pairs of divider walls positioned between adjacent columns of storage devices form large channels for increased airflow between columns of storage devices and reduced airflow between adjacent rows of storage devices. The design allows for increased cooling performance and reduced acoustic energy (noise).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.