Patent · US Active

PCB module on package

US11508663B2 · kind B2 · utility

0Cited by

7References

20Claims

0Family size

Assignee

Marvell Israel (M.I.S.L) Ltd. · IL

Inventors

Dan Azeroual · Usha, IL
Eldad Bar-Lev · Kiryat Tivon, IL

Key dates

Filing date	Jan 29, 2019
Grant date	Nov 22, 2022
Priority date	—
Expiry date	Jan 29, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/2036
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Aspects of the disclosure provide a printed circuit board (PCB) system that includes an integrated circuit (IC) package, a first PCB and a PCB module. The IC package has a package substrate and an IC chip that is coupled to a top surface of the package substrate. The first PCB is configured to electrically couple with first contact structures that are disposed on a bottom surface of the package substrate. The PCB module includes a second PCB and one or more electronic components electrically coupled to the second PCB. The PCB module is configured to electrically couple with second contact structures that are disposed on the top surface of the package substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.