Methods of manufacturing semiconductor package and package-on-package
US11508713B2 · kind B2 · utility
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6References
20Claims
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Key dates
| Filing date | Feb 5, 2021 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Jun 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor package includes forming a laser reactive polymer layer on a substrate; mounting a semiconductor device on the substrate; irradiating at least a portion of the laser reactive polymer layer below the semiconductor device with a laser having a wavelength capable of penetrating through the semiconductor device on the substrate to modify the laser reactive polymer layer to have a hydrophilic functional group; and forming a first encapsulation material layer between the semiconductor device and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.