Multi-color temperature and multi-channel EMC bracket structure
US11508886B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2020 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Jan 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/851
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multi-color temperature and multi-channel EMC bracket structure comprises a metal substrate with more than three pads arranged on a periphery thereof as multi-block electrodes. A cup-shaped insulating resin dam is located on the metal substrate. Part of the pad is located inside the insulating resin dam and another part of the pad is located outside the insulating resin dam. At least one white resin partition is arranged inside the insulating resin dam to divide the metal substrate into multiple areas for arranging different LED chip circuits respectively. The LED chip circuit comprising a plurality of LED chips. The spaces inside the cup-shaped insulating resin dam with respective to different LED chip circuits are encapsulated by fluorescent layers respectively, and the fluorescent layer is located on the LED chip. The present invention can be controlled in regions to achieve the effect of different color temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.