Temperature-controlled oscillating device
US11509311B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 10, 2021 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Aug 10, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03B5/04
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A temperature-controlled oscillating device includes a supporting base, a mounting glue, an IC, at least one conducting medium, a temperature sensor, a quartz crystal package, and a heater. The mounting glue is formed on the supporting base. The IC is formed on the mounting glue. The conducting medium and the temperature sensor are formed on the IC. The quartz crystal package is formed on the conducting medium. The quartz crystal package includes a first quartz substrate, a second quartz substrate, and a third quartz substrate. The heater is formed on the quartz crystal package or the IC. There is no base arranged between the IC and the quartz crystal package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.