Conductive laminated structure, a manufacturing method thereof, and a display panel
US11510323B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2019 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Apr 5, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present application discloses a conductive laminated structure, a manufacturing method thereof, and a display panel. The conductive laminated structure provided by the present application comprises a substrate; an adhesion enhancement layer disposed on the substrate; a metal nanowire layer disposed on the adhesion enhancement layer and having a first opening to expose the adhesion enhancement layer; a wiring layer disposed on the metal nanowire layer and having a second opening at least partially overlapping the first opening to expose the adhesion enhancement layer; and an optical adhesive layer disposed on the wiring layer, filled in the second opening and the first opening and connected to the adhesion enhancement layer. Because the metal nanowire layer is in direct contact with the wiring layer, the conducting capability is enhanced, and a reduced contacting area is needed, so that the wiring layer can be relatively narrow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.