Immersion heat dissipation structure
US11510342B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2021 |
| Grant date | Nov 22, 2022 |
| Priority date | — |
| Expiry date | Oct 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20481
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween. A super-wetting layer is formed on a connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-wetting layer has a wetting angle of less than 10 degrees to water. Alternatively, a super-hydrophobic layer is formed on the connection surface between the porous metal heat dissipation material and the thermal interface material, and the super-hydrophobic layer has a wetting angle of greater than 120 degrees to water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.