Multi component solid solution high-entropy alloys
US11511375B2 · kind B2 · utility
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Key dates
| Filing date | Feb 24, 2021 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Feb 24, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A multi-material component joined by a high entropy alloy is provided, as well as methods of making a multi-material component by joining dissimilar materials with high entropy alloys.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.