Patent · US Active

Molding system and methods for forming structures

US11511500B2 · kind B2 · utility

0Cited by
18References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 4, 2019
Grant dateNov 29, 2022
Priority date
Expiry dateNov 23, 2040

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29K2105/0872
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A molding system and methods of forming a structure are presented. The molding system is configured to sequentially form features of a structure. The molding system comprises a first tool comprising a number of features configured to completely form a first set of radii of a structure and a number of partial forming features configured to partially form a second set of radii of the structure, and a second tool comprising a number of completion features configured to complete shaping of the second set of radii.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.