Molding system and methods for forming structures
US11511500B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2019 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Nov 23, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0872
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding system and methods of forming a structure are presented. The molding system is configured to sequentially form features of a structure. The molding system comprises a first tool comprising a number of features configured to completely form a first set of radii of a structure and a number of partial forming features configured to partially form a second set of radii of the structure, and a second tool comprising a number of completion features configured to complete shaping of the second set of radii.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.