Insulated metal substrate and method for manufacturing same
US11511521B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2021 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | May 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0376
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.