Card substrate laminating device
US11511530B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2020 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | May 27, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A card substrate laminating device including a transfer roller configured to heat a portion of a transfer layer of a transfer ribbon and transfer the portion of the transfer layer from a carrier layer of the transfer ribbon to a surface of a card substrate. The transfer roller includes a diameter of less than 0.537 inches and a compliant exterior surface layer or coating. The compliant exterior surface layer or coating can include silicon rubber. The compliant exterior surface layer or coating can be approximately 0.020 inches thick. An internal heating element is configured to heat the transfer roller from an ambient temperature to a laminating temperature, at which laminating operations are performed, within 40 seconds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.