Inspection device and method for inspecting an adhesive pattern on a substrate
US11511531B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2017 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Dec 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/021
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Inspection devices and methods for inspecting an adhesive pattern on a substrate are disclosed. The inspection device includes at least one sensor having a heat sensor head for detecting a pattern of the adhesive bead, and a controller. Reference data representing a desired adhesive pattern is initially provided to a controller. A predetermined tolerance range for the desired adhesive pattern is also provided to the controller. An adhesive bead is discharged onto a substrate from a nozzle. A pattern of the discharged adhesive bead is then detected by the sensor when the substrate moves. Signals representing the detected pattern are received from the sensor at the controller. Finally, the signals representing the detected adhesive pattern are compared to the tolerance range of the desired adhesive pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.