Web with adhesive layer having partially embedded filaments
US11512228B2 · kind B2 · utility
0Cited by
21References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2016 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Jan 13, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/14
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive-backed film with an adhesive layer having thermoplastic or thermoset filaments partially projecting therefrom, to promote fluid egress and repositionability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.