Film formation device for cutting tool provided with coating film, and film formation method for cutting tool provided with coating film
US11512386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2020 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Mar 2, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/5806
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which is connected to the deposition chamber through a vacuum valve; and a conveying line that conveys the cutting tools from the pre-treatment chamber to the post-treatment chamber going through the deposition chamber, the in-line deposition apparatus using a conveyed carrier on which rods supporting cutting tools are provided in a standing state along a conveying direction. The deposition chamber includes: a deposition region; a conveying apparatus; a heating region; and a carrier-waiting region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.