Patent · US Active

Metal or metal alloy deposition composition and plating compound

US11512405B2 · kind B2 · utility

0Cited by

3References

14Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Angela Llavona-Serrano · Berlin, DE
Timo Bangerter · Berlin, DE
Olivier Mann · Berlin, DE
Pamela Cebulla · Berlin, DE
Stefanie ACKERMANN · Berlin, DE
Heiko Brunner · Berlin, DE
Kinga Haubner · Berlin, DE
Bernd Froese · Berlin, DE

Key dates

Filing date	Dec 14, 2018
Grant date	Nov 29, 2022
Priority date	—
Expiry date	Dec 14, 2038

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D3/64
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.