Packaging for microLEDs for chip to chip communication
US11513285B2 · kind B2 · utility
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8References
9Claims
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Key dates
| Filing date | Jan 8, 2021 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Jan 8, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A microLED based optical chip-to-chip interconnect may optically couple chips in a variety of ways. The microLEDs may be positioned within a waveguide, and the interconnects may be arranged as direct connections, in bus topologies, or as repeaters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.