Thermal diffuser for a semiconductor wafer holder
US11515190B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2019 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Apr 25, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck is formed by depositing a diffuser layer onto an electrostatic puck and removing areas of the diffuser layer to form discrete diffuser segments separated by gaps. The discrete diffuser segments may define continuous concentric rings, discontinuous concentric rings, or a combination of continuous concentric rings and discontinuous concentric rings. The discrete diffuser segments are separated from each other by forming at least one trench in the diffuser layer. The trench may extend partially through the diffuser layer, completely through the diffuser layer to the electrostatic puck, or have a first portion that extends partially through the diffuser layer and a second portion that extends completely through the diffuser layer. Also, the trench can have a constant width or have a variable width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.