Chip-scale optical interconnect using microLEDs
US11515356B2 · kind B2 · utility
5Cited by
9References
2Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 26, 2020 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Jun 26, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In package intra-chip and/or inter-chip optical communications are provided using microLEDs and photodetectors mounted to integrated circuit (IC) chips and/or to transceiver dies associated with the IC chips. Light from the LEDs may pass through waveguides on or in a substrate to which the IC chips are mounted or which couple the IC chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.