LED chip, LED array and LED packaging method
US11515452B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 9, 2019 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Oct 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/034
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure relates to an LED chip, an LED array and an LED packaging method. By adding a reflecting layer on the periphery of the LED, the reflecting layer adjusts the emission direction of light emitted by a light-emitting layer of the LED, so that the adjusted emission direction is more concentrated to a certain required illumination direction, and the light emitted by the light-emitting layer is prevented from irradiating adjacent LEDs and thereby causing interference to the adjacent LEDs. Therefore, according to the method provided by the disclosure, the light field directivity of the emitted light beam is improved, the embodiment is easy to operate with convenient implementation and improved LED performance, providing convenience for a user to use an LED lamp.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.