Heat transfer panel having non-planar internal channels with single planar joint
US11515591B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2020 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Jul 2, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat rejection panel comprising a first and a second plate. The first plate comprises an oscillating heat pipe face having a plurality of first opened elongated recesses formed therein, and the second plate comprises an oscillating heat pipe face having a plurality of second open elongated recesses formed therein. The first plate oscillating heat pipe face is hermetically sealed to the second plate oscillating heat pipe face forming a bond joint therebetween. The first plate caps the second open elongated recesses and the second plate caps the first open elongated recesses such that first open elongated recesses are physically and fluidly connected to the second open elongated recesses, thereby forming at least one non-planar oscillating heat pipe channel within the panel that reciprocates back and forth across the bond joint having the bond joint as a longitudinal axis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.