Multiple layer printed circuit board that includes multiple antennas and supports satellite communications
US11515647B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2021 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Jul 20, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q3/36
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Apparatuses, methods, and systems for a printed circuit board that includes multiple antennas, and operates to support satellite communications, are disclosed. One apparatus includes a first flat panel element. The first flat panel element includes a multilayer PCB (printed circuit board). The multilayer PCB includes a first exterior layer comprising N antenna elements, and a second exterior layer comprising N RF (radio frequency) chains operative to process the RF signals, each of the N RF chains electrically connected to a one of the N antenna elements, and N metal patches arranged in a square, wherein an air gap is located between the N metal patches and the N antenna elements, wherein dimensions, orientation, and spacing between the N metal patches and the N antenna elements are selected based on a carrier frequency, bandwidth, and directionality of the propagated RF signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.