Electronic component mounting substrate and manufacturing method thereof
US11516923B2 · kind B2 · utility
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1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2020 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Feb 24, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.