Immersion cooling systems and methods for electrical power components
US11516948B2 · kind B2 · utility
0Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2020 |
| Grant date | Nov 29, 2022 |
| Priority date | — |
| Expiry date | Mar 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20936
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system includes a vessel, a cooling fluid in the vessel, and at least one power magnetics assembly in the vessel and immersed in the cooling fluid. The system further includes at least one heat sink having a surface in contact with the cooling fluid in the vessel and at least one power semiconductor device mounted on the at least one heat sink. The cooling fluid may be electrically insulating and the vessel may be sealed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.