Laser cutting machine and method for cutting workpieces of different thicknesses

US11517978B2 · kind B2 · utility

Assignee

• TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

• Tim Hesse · Ditzingen, DE
• Tobias Kaiser · Rutesheim, DE

Key dates

• Filing date: May 10, 2019
• Grant date: Dec 6, 2022
• Expiry date: Aug 1, 2039

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/067
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method for cutting workpieces of different thicknesses includes providing at least one unprocessed laser beam, selectively forming a processing laser beam from the at least one unprocessed laser beam in accordance with a thickness of the workpiece, and cutting the workpiece with the processing laser beam. Forming the processing laser beam includes selectively coupling one or more unprocessed laser beams into one or more of a plurality of parallel, non-concentric fibers of a compound fiber, the plurality of fibers of the compound fiber having different cross-sectional shapes. A laser beam characteristic of the processing laser beam exiting the compound fiber differs depending upon which fibers of the compound fiber receive the at least one unprocessed laser beam, the laser beam characteristic of the processing laser beam differing depending on the thickness.