Patent · US Active

Assembly apparatus

US11517992B2 · kind B2 · utility

0Cited by

12References

2Claims

0Family size

Assignee

SUBARU CORPORATION · JP

Inventors

Yoichi Sato · Saitama, JP
Marosuke Kikuchi · Tokyo, JP

Key dates

Filing date	Oct 2, 2020
Grant date	Dec 6, 2022
Priority date	—
Expiry date	Oct 2, 2040

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB64C3/185
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An assembly apparatus includes a retainer, a position measurement device, and a machining device. The retainer is configured to hold an assembly. The position measurement device is configured to measure a difference between an intended machining position and an actual machining position of a first coupling hole in a first assembly component. The first coupling hole is capable of being coupled to the assembly. The machining device is configured to form a second coupling hole capable of communicating with the first coupling hole in the assembly based on a reference position set on the assembly and the difference.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.