Low viscosity dual cure additive manufacturing resins
US11518089B2 · kind B2 · utility
1Cited by
16References
29Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 21, 2020 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Apr 21, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2003/2241
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided herein according to some embodiments is a dual cure additive manufacturing resin, comprising: (i) a light polymerizable component, (ii) a photoinitiator, (iii) a heat polymerizable component, and (iv) a non-reactive diluent, which resin is useful for the production of three-dimensional objects by additive manufacturing. Methods of using the same are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.