Three-dimensional structure and method of manufacturing three-dimensional structure
US11518101B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Apr 11, 2018 |
| Grant date | Dec 6, 2022 |
| Priority date | — |
| Expiry date | Nov 1, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/34
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A three-dimensional structure according to an embodiment of the present disclosure includes: a plurality of resin layers including a light curable resin, the light curable resin including a coloring compound, a color developing-reducing agent, and a photothermal conversion agent, the plurality of resin layers being stacked, the color developing-reducing agent having an average particle diameter of 10 μm or more and 100 μm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.